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EXPERTISE

MEMS Technology

HICOMP is a professional MEMS manufacturing service provider with a range of core technologies and unique manufacturing processes. The company's MEMS processing capabilities are particularly robust, with strengths in key areas such as photolithography, etching, thin film deposition, and TSV. HICOMP offers comprehensive technical support to customers from prototype design through to mass production. Notably, HICOMP has developed a unique MEMS metal mold core manufacturing process that produces high-precision injection molds. This process not only improves the processing accuracy and surface quality of injection molds, but also significantly shortens the production cycle and reduces costs. Thanks to its strong technical expertise and wealth of experience in the field of MEMS manufacturing, HICOMP has established itself as a trusted partner for customers.

Photolithography

Etching

Film Deposition

Through-Silicon Via

Photolithography

SU8 Single-layer

SU8 Double-layer

Etching

Deep silicon etch

Nanometer-precision Linear

Wet etch

Film Deposition

Sputter : Al, Al(Cu), Cu, Ti, TiN, Ta, TaN, W, Pt, Au, Pre clean

Evaporate : Al, Pt, Ti, Cr, Au, Ag, Sn

Through-Silicon Via

Diameter: 20-30um Aspect ratio: 10:1

material: copper, gold

status: solid hole, hollow hole

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