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EXPERTISE

MEMS Technology

HICOMP is a professional MEMS manufacturing service provider with a range of core technologies and unique manufacturing processes. The company's MEMS processing capabilities are particularly robust, with strengths in key areas such as photolithography, etching, thin film deposition, and TSV. HICOMP offers comprehensive technical support to customers from prototype design through to mass production. Notably, HICOMP has developed a unique MEMS metal mold core manufacturing process that produces high-precision injection molds. This process not only improves the processing accuracy and surface quality of injection molds, but also significantly shortens the production cycle and reduces costs. Thanks to its strong technical expertise and wealth of experience in the field of MEMS manufacturing, HICOMP has established itself as a trusted partner for customers.

Photolithography

Etching

Film Deposition

Through-Silicon Via

Photolithography.bmp

SU8 Single-layer

SU8 Double-layer

Etching.bmp

Deep silicon etch

Nanometer-precision Linear

Wet etch

Film Deposition.bmp

Sputter : Al, Al(Cu), Cu, Ti, TiN, Ta, TaN, W, Pt, Au, Pre clean

Evaporate : Al, Pt, Ti, Cr, Au, Ag, Sn

Through-Silicon Via.bmp

Diameter: 20-30um Aspect ratio: 10:1

material: copper, gold

status: solid hole, hollow hole

PDMS Technology

 At Hicomp, we provide customized PDMS microfluidic chips to meet our customers' specific needs. We use advanced technology and expertise to create microfluidic devices that range from simple to complex designs. Our solution includes chip design, fabrication, staining, and assembly, as well as additional processes like custom holes, valves, metal electrodes, and embedded components. Our solutions are reliable, cost-effective, and high-quality, and they can be used in various fields, such as medical diagnostics, biotechnology, and environmental analysis. We have an experienced team and use cutting-edge technology to ensure that we deliver every project with the highest level of quality and efficiency. We are committed to customer satisfaction.

Proprietary Technology:

Micro-channel PDMS chip

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PDMS membrane

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Smooth PDMS chip holes

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High planarity PDMS chip

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Multilayer PDMS alignment bonding

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Integration of metal electrodes or films into PDMS chips

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Glass

 At Hicomp, we provide customized PDMS microfluidic chips to meet our customers' specific needs. We use advanced technology and expertise to create microfluidic devices that range from simple to complex designs. Our solution includes chip design, fabrication, staining, and assembly, as well as additional processes like custom holes, valves, metal electrodes, and embedded components. Our solutions are reliable, cost-effective, and high-quality, and they can be used in various fields, such as medical diagnostics, biotechnology, and environmental analysis. We have an experienced team and use cutting-edge technology to ensure that we deliver every project with the highest level of quality and efficiency. We are committed to customer satisfaction.

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Plastic

HICOMP is a leading company specializing in advanced mold and micro-injection molding technologies. We have a strong focus on producing highly intricate and complex three-dimensional micro-injection molding products such as flow channels, micro-columns, storage tanks, and other structures across a range of different scales. Our unique technology secrets and key processes are designed to ensure that our products achieve exceptional quality and precision throughout the entire manufacturing process

Manufacturing process of plastic microfluidic chips and the critical processes involved

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Product design

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Precision mold

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Precision injection molding

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Post-processing technique

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Quality control

1)Concept design

2)prototyping

3)principle verification

1)Unique metal mold micro/nano processing technology

1)Injection molding

2)embossing

1)Low-temperature bonding 2)cutting,

3)hydrophilic treatment, 4)hydrophobic treatment, 5)protein encapsulation, 6)reagent embedding

1)Dimensional measurement, 2)flatness inspection, 3)optical performance testing,

4)functional verification

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