Microfluidic bonding and sealing are critical processes in the fabrication of microfluidic devices, ensuring the structural integrity and functionality of the chips. These techniques involve joining multiple layers of materials, such as PMMA (polydimethylsiloxane) or COC, and creating hermetic seals to prevent leakage and contamination. Proper bonding and sealing are essential for achieving reliable, high-performance devices across various applications, including diagnostics, drug development, and life sciences research.

At Hicomp, we have extensive experience in microfluidic bonding and sealing, offering tailored solutions for a wide range of needs. Our expertise allows us to recommend and implement the most suitable bonding processes for each specific application, ensuring optimal performance and durability. Whether it's thermal bonding, Laser welding, or PSA bonding, we provide reliable and scalable solutions to meet the demands of our customers.