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Bonding & Sealing

Overview

Microfluidic Bonding & Sealing

Microfluidic bonding and sealing are critical processes in the fabrication of microfluidic devices, ensuring the structural integrity and functionality of the chips. These techniques involve joining multiple layers of materials, such as PMMA (polydimethylsiloxane) or COC, and creating hermetic seals to prevent leakage and contamination. Proper bonding and sealing are essential for achieving reliable, high-performance devices across various applications, including diagnostics, drug development, and life sciences research.

At Hicomp, we have extensive experience in microfluidic bonding and sealing, offering tailored solutions for a wide range of needs. Our expertise allows us to recommend and implement the most suitable bonding processes for each specific application, ensuring optimal performance and durability. Whether it's thermal bonding, Laser welding, or PSA bonding, we provide reliable and scalable solutions to meet the demands of our customers.
 

Comparison of Microfluidic Bonding Technigues

Bonding Technique

HiComp Showcases

Best Use Case

Advantages

Disadvantages

UV Curable ResinAdhesive

UV Curable ResinAdhesive

  • Cell culture microplateso

  • Cell Counting Slides

  • Rapid, scalable, and suitable for automated processes

  • Controlled adhesive layer thickness

  • High bond strength

 

  • Prone to channel blockageo

  • Mixed materials

  • Limited channel depth flexibility

  • Bubbles

  • Shrinkage Deformation

Pressure SensitiveAdhesive (PSA)

Pressure SensitiveAdhesive (PSA)

  • Reagent Discs

  • Microplates

  • High bond strength

  • Flexible

  • Short processing times

  • Compatible with hydrophilic/hydrophobic coatings

  • Limited shelf life​

  • Limited bond strength

  • Bubbles

  • Poor Compatibility with Reagents

Laser Welding

Laser Welding

  • PoCT

  • Cartridgeo

  • Organ-on-chip

  • NGS

  • Microplates

  • No additives required

  • Short processing times

  • Highly accurate alignment

  • Enables bonding of dissimilar materials

  • Thermal expansion of weld area

  • Requires complex fixtures and clamping

  • Risk of warping due to heat

Thermal Fusion Bonding

Thermal Fusion Bonding

  • Microreactors

  • Pure surface bonding without additives

  • Maintains opticaltransparency

  • High bonding strength

  • Hermetic sealing

  • Simplified process

  • Slower cycle times

  • Limited scalability

  • Deformation risk

  • Process compatibility issues

Ultrasonic Welding

Ultrasonic Welding

  • POCT Cartridges

  • Microplates

  • Short cycle times

  • Suitable for batch processing

  • Effective for macro-scale cartridge assembly

  • Established, low-cost technology

  • Less accurate than other techniques

  • Needs custom fixtures

  • Rough bonding

  • Uneven energy distributioncomplicates melt flow control

Solvent Bonding

Solvent Bonding

  • Droplet Generator

  • Clean full-surface bonding

  • High bond strength

  • Low process complexity

  • Adaptable to different designs

  • Slow cycle times

  • Difficult to control

  • Potential chemical sensitivities

  • Environmental and safety concerns

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