Bonding & Sealing

Overview

Microfluidic Bonding & Sealing

Microfluidic bonding and sealing are critical processes in the fabrication of microfluidic devices, ensuring the structural integrity and functionality of the chips. These techniques involve joining multiple layers of materials, such as PMMA (polymethyl methacrylate) or COC, and creating hermetic seals to prevent leakage and contamination. Proper bonding and sealing are essential for achieving reliable, high-performance devices across various applications, including diagnostics, drug development, and life sciences research.

At Hicomp, we have extensive experience in microfluidic bonding and sealing, offering tailored solutions for a wide range of needs. Our expertise allows us to recommend and implement the most suitable bonding processes for each specific application, ensuring optimal performance and durability. Whether it's thermal bonding, Laser welding, or PSA bonding, we provide reliable and scalable solutions to meet the demands of our customers.

Comparison of Microfluidic Bonding Technigues

Bonding Technique

HiComp Showcases

Best Use Case

Advantages

Disadvantages

UV Curable ResinAdhesive

Cell culture microplateso
Cell Counting Slides

Rapid, scalable, and suitable for automated processes
Controlled adhesive layer thickness
High bond strength

Prone to channel blockageo
Mixed materials
Limited channel depth flexibility
Bubbles
Shrinkage Deformation

Pressure SensitiveAdhesive (PSA)

Reagent Discs
Microplates

High bond strength
Flexible
Short processing times
Compatible with hydrophilic/hydrophobic coatings

Limited shelf life
Limited bond strength
Bubbles
Poor Compatibility with Reagents

Laser Welding

PoCT
Cartridgeo
Organ-on-chip
NGS
Microplates

No additives required
Short processing times
Highly accurate alignment
Enables bonding of dissimilar materials

Thermal expansion of weld area
Requires complex fixtures and clamping
Risk of warping due to heat

Thermal Fusion Bonding

Microreactors

Pure surface bonding without additives
Maintains opticaltransparency
High bonding strength
Hermetic sealing
Simplified process

Slower cycle times
Limited scalability
Deformation risk
Process compatibility issues

Ultrasonic Welding

POCT Cartridges
Microplates

Short cycle times
Suitable for batch processing
Effective for macro-scale cartridge assembly
Established, low-cost technology

Less accurate than other techniques
Needs custom fixtures
Rough bonding
Uneven energy distributioncomplicates melt flow control

Solvent Bonding

Droplet Generator

Clean full-surface bonding
High bond strength
Low process complexity
Adaptable to different designs

Slow cycle times
Difficult to control
Potential chemical sensitivities
Environmental and safety concerns

Case Studies

Case Study
Microfluidic LNP Synthesis Platform
Advanced lipid nanoparticle manufacturing system

HiComp transforms lipid nanoparticle synthesis from traditional batch processing to continuous, automated production by integrating precision MEMS fabrication with thermoplastic chip manufacturing.

Challenges

Manufacturing Pain Points

High PDI variation in traditional batch synthesis
Scale-up gap from lab to commercial GMP volumes
Reagent loss and inconsistency in manual mixing
Pharma-grade traceability and validation burden

Solution

Integrated microfluidic platform

PDMS prototyping → COC commercial chip pathway
MEMS microstructures with sub-micron channel control
Multi-bonding (thermal, ultrasonic, laser, solvent)
Continuous-flow lipid–aqueous mixing architecture

Delivery

Validated production outcomes

Reproducible particle size and tight PDI control
Lab-to-commercial scale-up with no requalification
Ra 0.02 surface, >0.6 MPa pressure validated
ISO 13485 / ISO 7 cleanroom-manufactured chips

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