WHAT WE DO
MEMS Manufacturing
MEMS (Microelectromechanical Systems) technology is an interdisciplinary field that combines electrical, mechanical, and materials engineering to create small-scale devices and systems. These devices are typically on the scale of micrometers and can range from sensors and actuators to complete microsystems. The fabrication process for MEMS involves a combination of microfabrication and semiconductor processing techniques, such as photolithography, etching, and deposition.
As MEMS technology continues to evolve, it has the potential to revolutionize many industries and create new opportunities for innovation and growth.
Our company has established a 200+ square meter Class 1000 cleanroom as a MEMS research and development and small batch production workshop. We are equipped with the latest state-of-the-art equipment, including SUSS photolithography machines, magnetron sputtering systems, etchers, spin coaters, programmable heat plates and other ion processing machines.
We also have imported microscopes, step profilers, and other testing equipment. We provide a complete solution from chip design to process fabrication and have the capability for mass production while ensuring timely delivery and quality assurance. This enables us to offer a comprehensive solution, from chip design to final product, and to ensure high quality and reliable MEMS devices for our customers.
That’s what our customers trust in.
Here is a brief introduction to the SU-8 mold fabrication process:
Substrate
Preparation
Spin-Coating
Prebake
Mask Alignment
Exposure
Development
Step
1
Etching
Post-bake
Step
3
Step
2
Step
4
Step
5
Step
6
Step
7
Step
8
MEMS Technology
HICOMP is a professional MEMS manufacturing service provider with a range of core technologies and unique manufacturing processes. The company's MEMS processing capabilities are particularly robust, with strengths in key areas such as photolithography, etching, thin film deposition, and TSV. HICOMP offers comprehensive technical support to customers from prototype design through to mass production. Notably, HICOMP has developed a unique MEMS metal mold core manufacturing process that produces high-precision injection molds. This process not only improves the processing accuracy and surface quality of injection molds, but also significantly shortens the production cycle and reduces costs. Thanks to its strong technical expertise and wealth of experience in the field of MEMS manufacturing, HICOMP has established itself as a trusted partner for customers.
Photolithography
Etching
Film Deposition
Through-Silicon Via
SU8 Single-layer
SU8 Double-layer
Deep silicon etch
Nanometer-precision Linear
Wet etch
Sputter : Al, Al(Cu), Cu, Ti, TiN, Ta, TaN, W, Pt, Au, Pre clean
Evaporate : Al, Pt, Ti, Cr, Au, Ag, Sn
Diameter: 20-30um Aspect ratio: 10:1
material: copper, gold
status: solid hole, hollow hole
Glass
At Hicomp, we provide customized PDMS microfluidic chips to meet our customers' specific needs. We use advanced technology and expertise to create microfluidic devices that range from simple to complex designs. Our solution includes chip design, fabrication, staining, and assembly, as well as additional processes like custom holes, valves, metal electrodes, and embedded components. Our solutions are reliable, cost-effective, and high-quality, and they can be used in various fields, such as medical diagnostics, biotechnology, and environmental analysis. We have an experienced team and use cutting-edge technology to ensure that we deliver every project with the highest level of quality and efficiency. We are committed to customer satisfaction.
