PDMS Microfluidics
From Prototype to Production

Our closed replica mold, described by what it carries. The mold is made in a proprietary resin and closes on the part, so there is no free surface set by gravity and surface tension: thickness, planarity and surface finish become process settings with tolerances rather than outcomes measured afterwards. "Integrated" refers to the features formed in the mold itself — through-holes, ports and reservoirs that traditionally need a second operation, punching, drilling or machining, come out of the mold finished. The same tool survives a hundred-plus cycles at 2 µm, against thirty to fifty for an SU-8 wafer.

Yes. PDMS carries an NRE for the closed replica mold and its tooling, and a higher unit cost; molding carries a steel tool and the lower unit cost. We recommend molding DFM once forecast demand passes roughly 500 parts a month, the design is frozen, and the material is chemically compatible with the application.

No. Quantity one is a real order. Pricing improves with batch size.

Two to three weeks after design confirmation. Expedites are available.

Bubble-free glass-to-PDMS and PDMS-to-PDMS bonding above 60 psi, in stacks of two to eight layers. Reversible bonding is available. Membranes and electrodes can be embedded within the stack.

Yes. Between roughly 100 and 500 pieces per order we run selected closed-mold steps to lift yield without committing to the full production line.

Because it is a quote for a different silicone and a different deliverable. SYLGARD™ 184 cannot be injection molded — its fastest published cure is 10 minutes at 150 °C, and a molding cycle is seconds. So a part that was injection molded is a liquid silicone rubber (LSR). LSR cannot be plasma-bonded directly to glass the way SYLGARD™ 184 can, which is why those suppliers typically do not offer bonding. The chip still needs an adhesive layer or a clamp, and that step is left to you. We use Dow SYLGARD™ 184, and SYLGARD™ 182 where a slower cure is needed — no other silicone — and our quote covers the bonded, inspected device.