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High-Performance Glass Microfluidics

At HICOMP, we specialize in the custom design, rapid prototyping, and contract manufacturing of high-performance glass microfluidic devices. Utilizing advanced femtosecond laser micromachining, we overcome the limitations of conventional etching to deliver complex 3D architectures with sub-micron accuracy across all glass types.
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Whether you are developing platforms for Next-Generation Sequencing (NGS), Single-Cell Analysis, Point-of-Care (PoC) Diagnostics, or EWOD applications, our expertise ensures ultra-clean results with superior optical clarity and chemical resistance.

Specialized Product Applications

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Diagnostics & Genomics

High-transparency Flow Cells designed for Next-Generation Sequencing (NGS) and consistent fluid control.

Cell Biology

Specialized Single-Cell/Single-Molecule Analysis chips featuring microwell and pillar arrays for high-sensitivity research.

Digital Microfluidics

EWOD (Electrowetting-on-Dielectric) chips with engineered substrates for precise droplet manipulation.

Chemical Synthesis

Robust Flow Reactors with multi-layer designs and high bonding strength capable of withstanding harsh conditions.

Device Manufacturing Capabilities

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​We offer:

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  • Glass Micromachining: High-resolution Dry/Wet etching and glass micro-molding with feature sizes as small as 1 μm.

  • Precision Laser Drilling: Specialized laser drilling for high-aspect-ratio holes with edge-chipping controlled to < 5 μm.

  • Advanced Glass Bonding: Direct and intermediate-layer bonding with industry-leading alignment accuracy of ≤ 10 μm.

  • Patterned Electrodes: Integration of precision electrodes directly onto glass substrates for active fluid control.

Technical Spec and Device Features

Glass microfluidics are essential across diverse sectors, including high-throughput NGS, single-cell and single-molecule analysis, point-of-care diagnostics, and advanced flow chemistry.

 

While we provide the flexibility to investigate other materials such as silicon and PDMS, glass remains the gold standard for applications requiring superior optical clarity, chemical inertness, and mechanical stability. The ideal material selection is always driven by your specific application requirements, solvent compatibility, design complexity, and project budget.

Microstructure

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  • Substrate Thickness: 0.1 - 2.0 mm

  • Thickness Uniformity: +/- 5 μm

  • Surface Roughness (Ra): < 2 nm

  • Channel Size: Length ≥ 50 μm, Width ≥ 10 μm

Microwell

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  • Feature Size (Well/Pillar): Down to 2 μm

  • Aperture Diameter: > 0.1 μm

  • Aperture Uniformity: CV < 5%

  • Aspect Ratio: < 10

  • Tilt Angle: 80 - 90 degrees

  • Hole Pitch: > 0.1 μm

Glass Drilling

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  • Aperture Diameter: 0.1 - 10 mm

  • Edge-chipping Size: < 5 μm

  • Taper Control: Upper/Lower difference < 10%

  • Position Accuracy: ± 25 μm

Bonding

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  • Bonding Process: Laser bonding, UV bonding, Anodic bonding, or PSA bonding

  • Alignment Accuracy: 50 μm

  • Material Combinations:

    • Glass-to-Glass Bonding

    • Glass-to-Silicon Bonding

    • Glass-to-Polymer/Plastic Bonding

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​Laser Drilling

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Patterned Electrodes

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Glass Microchannel

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Glass Micro-well/pillar Array

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